Chipbond Technology Corporation 6147.TWO Stock
Chipbond Technology Corporation Price Chart
Chipbond Technology Corporation 6147.TWO Financial and Trading Overview
| Chipbond Technology Corporation stock price | 77.7 TWD |
| Previous Close | 64.1 TWD |
| Open | 65 TWD |
| Bid | 64.9 TWD x N/A |
| Ask | 65 TWD x N/A |
| Day's Range | 64.2 - 65.3 TWD |
| 52 Week Range | 49.2 - 71.5 TWD |
| Volume | 7.22M TWD |
| Avg. Volume | 2.92M TWD |
| Market Cap | 47.94B TWD |
| Beta (5Y Monthly) | 0.586986 |
| PE Ratio (TTM) | 9.544118 |
| EPS (TTM) | 5.33 TWD |
| Forward Dividend & Yield | 5.5 (7.90%) |
| Ex-Dividend Date | June 16, 2023 |
| 1y Target Est | 55.95 TWD |
6147.TWO Valuation Measures
| Enterprise Value | 48.13B TWD |
| Trailing P/E | 9.544118 |
| Forward P/E | 10.552846 |
| PEG Ratio (5 yr expected) | -0.92 |
| Price/Sales (ttm) | 2.192199 |
| Price/Book (mrq) | 1.2306818 |
| Enterprise Value/Revenue | 2.201 |
| Enterprise Value/EBITDA | 5.618 |
Trading Information
Chipbond Technology Corporation Stock Price History
| Beta (5Y Monthly) | 0.586986 |
| 52-Week Change | 1.90% |
| S&P500 52-Week Change | 20.43% |
| 52 Week High | 71.5 TWD |
| 52 Week Low | 49.2 TWD |
| 50-Day Moving Average | 67.25 TWD |
| 200-Day Moving Average | 61.36 TWD |
6147.TWO Share Statistics
| Avg. Volume (3 month) | 2.92M TWD |
| Avg. Daily Volume (10-Days) | 4.2M TWD |
| Shares Outstanding | 738.68M |
| Float | 590.67M |
| Short Ratio | N/A |
| % Held by Insiders | 16.96% |
| % Held by Institutions | 20.70% |
| Shares Short | N/A |
| Short % of Float | N/A |
| Short % of Shares Outstanding | N/A |
Dividends & Splits
| Trailing Annual Dividend Rate | 5.5 |
| Trailing Annual Dividend Yield | 8.58% |
| 5 Year Average Dividend Yield | 618.00% |
| Payout Ratio | 0.8824 |
| Last Split Factor | 102.276:100 |
Financial Highlights
Fiscal Year
| Fiscal Year Ends | December 31, 2022 |
| Most Recent Quarter (mrq) | March 31, 2023 |
| Next Fiscal Year End | December 31, 2023 |
Profitability
| Profit Margin | 23.55% |
| Operating Margin (ttm) | 22.38% |
| Gross Margin | 30.79% |
| EBITDA Margin | 39.17% |
Management Effectiveness
| Return on Assets (ttm) | 5.71% |
| Return on Equity (ttm) | 12.67% |
Income Statement
| Revenue (ttm) | 21.87B TWD |
| Revenue Per Share (ttm) | 29.61 TWD |
| Quarterly Revenue Growth (yoy) | -31.80% |
| Gross Profit (ttm) | 7.83B TWD |
| EBITDA | 8.57B TWD |
| Net Income Avi to Common (ttm) | 5.15B TWD |
| Diluted EPS (ttm) | 6.8 |
| Quarterly Earnings Growth (yoy) | -61.39% |
Balance Sheet
| Total Cash (mrq) | 6.74B TWD |
| Total Cash Per Share (mrq) | 9.13 TWD |
| Total Debt (mrq) | 3.46B TWD |
| Total Debt/Equity (mrq) | 8.87 TWD |
| Current Ratio (mrq) | 1.196 |
| Book Value Per Share (mrq) | 52.735 |
Cash Flow Statement
| Operating Cash Flow (ttm) | 8.45B TWD |
| Levered Free Cash Flow (ttm) | 8.42B TWD |
Profile of Chipbond Technology Corporation
| Country | Taiwan |
| State | N/A |
| City | Hsinchu City |
| Address | No.3, Li Hsin 5th Rd |
| ZIP | 300 |
| Phone | 886 3 567 8788 |
| Website | https://www.chipbond.com.tw |
| Industry | Semiconductors |
| Sector(s) | Technology |
| Full Time Employees | N/A |
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers turnkey services for LCD driver IC package and testing; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components. Chipbond Technology Corporation was incorporated in 1997 and is based in Hsinchu City, Taiwan.
Q&A For Chipbond Technology Corporation Stock
What is a current 6147.TWO stock price?
Chipbond Technology Corporation 6147.TWO stock price today per share is 77.7 TWD.
How to purchase Chipbond Technology Corporation stock?
You can buy 6147.TWO shares on the Taipei Exchange exchange. Contact your financial advisor to select a broker.
What is the ticker symbol for Chipbond Technology Corporation?
The stock symbol or ticker of Chipbond Technology Corporation is 6147.TWO.
Which industry does the Chipbond Technology Corporation company belong to?
The Chipbond Technology Corporation industry is Semiconductors.
How many shares does Chipbond Technology Corporation have in circulation?
The max supply of Chipbond Technology Corporation shares is 744.68M.
What is Chipbond Technology Corporation Price to Earnings Ratio (PE Ratio)?
Chipbond Technology Corporation PE Ratio is 14.57786100 now.
What was Chipbond Technology Corporation earnings per share over the trailing 12 months (TTM)?
Chipbond Technology Corporation EPS is 5.33 TWD over the trailing 12 months.
Which sector does the Chipbond Technology Corporation company belong to?
The Chipbond Technology Corporation sector is Technology.