China Wafer Level CSP Co., Ltd. 603005.SS Stock
China Wafer Level CSP Co., Ltd. Price Chart
China Wafer Level CSP Co., Ltd. 603005.SS Financial and Trading Overview
China Wafer Level CSP Co., Ltd. stock price | 16.45 CNY |
Previous Close | 21.1 CNY |
Open | 21.12 CNY |
Bid | 21.25 CNY x 0 |
Ask | 21.26 CNY x 0 |
Day's Range | 20.92 - 21.37 CNY |
52 Week Range | 17.72 - 31.2 CNY |
Volume | 14.86M CNY |
Avg. Volume | 40.62M CNY |
Market Cap | 13.88B CNY |
Beta (5Y Monthly) | 0.186301 |
PE Ratio (TTM) | 132.8125 |
EPS (TTM) | 0.18 CNY |
Forward Dividend & Yield | N/A (N/A) |
Ex-Dividend Date | May 20, 2022 |
1y Target Est | 24 CNY |
603005.SS Valuation Measures
Enterprise Value | 13.05B CNY |
Trailing P/E | 132.8125 |
Forward P/E | 38.636364 |
PEG Ratio (5 yr expected) | N/A |
Price/Sales (ttm) | 13.553505 |
Price/Book (mrq) | 3.7784495 |
Enterprise Value/Revenue | 12.742 |
Enterprise Value/EBITDA | 55.067 |
Trading Information
China Wafer Level CSP Co., Ltd. Stock Price History
Beta (5Y Monthly) | 0.186301 |
52-Week Change | -3.16% |
S&P500 52-Week Change | 20.43% |
52 Week High | 31.2 CNY |
52 Week Low | 17.72 CNY |
50-Day Moving Average | 23.55 CNY |
200-Day Moving Average | 21.86 CNY |
603005.SS Share Statistics
Avg. Volume (3 month) | 40.62M CNY |
Avg. Daily Volume (10-Days) | 19.5M CNY |
Shares Outstanding | 653.21M |
Float | 560.73M |
Short Ratio | N/A |
% Held by Insiders | 3.90% |
% Held by Institutions | 31.91% |
Shares Short | N/A |
Short % of Float | N/A |
Short % of Shares Outstanding | N/A |
Dividends & Splits
Trailing Annual Dividend Rate | 0.07 |
Trailing Annual Dividend Yield | 0.33% |
5 Year Average Dividend Yield | 53.00% |
Payout Ratio | 1.7688 |
Last Split Factor | 1.3:1 |
Financial Highlights
Fiscal Year
Fiscal Year Ends | December 31, 2022 |
Most Recent Quarter (mrq) | March 31, 2023 |
Next Fiscal Year End | December 31, 2023 |
Profitability
Profit Margin | 16.06% |
Operating Margin (ttm) | 7.75% |
Gross Margin | 34.96% |
EBITDA Margin | 23.14% |
Management Effectiveness
Return on Assets (ttm) | 1.07% |
Return on Equity (ttm) | 4.19% |
Income Statement
Revenue (ttm) | 1.02B CNY |
Revenue Per Share (ttm) | 1.53 CNY |
Quarterly Revenue Growth (yoy) | -26.80% |
Gross Profit (ttm) | 488.33M CNY |
EBITDA | 236.98M CNY |
Net Income Avi to Common (ttm) | 164.51M CNY |
Diluted EPS (ttm) | 0.16 |
Quarterly Earnings Growth (yoy) | -68.89% |
Balance Sheet
Total Cash (mrq) | 2.48B CNY |
Total Cash Per Share (mrq) | 3.47 CNY |
Total Debt (mrq) | 356.07M CNY |
Total Debt/Equity (mrq) | 8.79 CNY |
Current Ratio (mrq) | 4.803 |
Book Value Per Share (mrq) | 5.624 |
Cash Flow Statement
Operating Cash Flow (ttm) | 358.71M CNY |
Levered Free Cash Flow (ttm) | 130.22M CNY |
Profile of China Wafer Level CSP Co., Ltd.
Country | China |
State | N/A |
City | Suzhou |
Address | Suzhou Industrial Park |
ZIP | 215026 |
Phone | 86 512 6773 0001 |
Website | https://www.wlcsp.com |
Industry | Semiconductors |
Sector(s) | Technology |
Full Time Employees | 973 |
China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers image sensor, biometric identification, and ambient light sensor chips, as well as medical electronic devices and automotive sensors. The company also provides infrastructure solutions, including design, test, and logistics; design chain management; design for manufacturing; design for cost; full design and verification of WL, leadframe, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services. In addition, it offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives; and FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. The company serves consumer, computing, communication, and medical markets. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.
Q&A For China Wafer Level CSP Co., Ltd. Stock
What is a current 603005.SS stock price?
China Wafer Level CSP Co., Ltd. 603005.SS stock price today per share is 16.45 CNY.
How to purchase China Wafer Level CSP Co., Ltd. stock?
You can buy 603005.SS shares on the Shanghai exchange. Contact your financial advisor to select a broker.
What is the ticker symbol for China Wafer Level CSP Co., Ltd.?
The stock symbol or ticker of China Wafer Level CSP Co., Ltd. is 603005.SS.
Which industry does the China Wafer Level CSP Co., Ltd. company belong to?
The China Wafer Level CSP Co., Ltd. industry is Semiconductors.
How many shares does China Wafer Level CSP Co., Ltd. have in circulation?
The max supply of China Wafer Level CSP Co., Ltd. shares is 652.61M.
What is China Wafer Level CSP Co., Ltd. Price to Earnings Ratio (PE Ratio)?
China Wafer Level CSP Co., Ltd. PE Ratio is 91.38889000 now.
What was China Wafer Level CSP Co., Ltd. earnings per share over the trailing 12 months (TTM)?
China Wafer Level CSP Co., Ltd. EPS is 0.18 CNY over the trailing 12 months.
Which sector does the China Wafer Level CSP Co., Ltd. company belong to?
The China Wafer Level CSP Co., Ltd. sector is Technology.
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