Integrated Service Technology Inc. 3289.TWO Stock

Integrated Service Technology Inc. provides IC circuit debugging, and verification and analysis services to the IC engineering industry in Taiwan and internationally. It offers mass production services consisting of MOSFET wafer backend processes, such as chemical/electro-less plating and front-side metal sputtering deposition; MOSFET backside grinding processes, including wafer thinning/non-taiko grinding/conventional grinding; MOSFET backside metallization processes comprising metal evaporation deposition and thick Ag process; and turnkey solutions for backend processes, which include chip probing, laser marking, vacuum mounting, ring removal, die sawing, frame probing, tape and reel solutions, and final test. The company also provides verification analysis services, such as focused ion beam (FIB) circuit edit; engineering sample preparation services, including wafer dicing saw, die bonding, IC wire bonding/assembly solutions, and surface mount technique process; failure analysis that include electrical characteristics measurement, non-destructive analysis, sample preparation, defect detection, and competitive analysis services; and connectivity test, certification, and design quality management services. In addition, it offers material analysis solutions comprising sample preparation, structure observation, surface analysis, and thermal and component analysis services; reliability design test, including component and board level reliability test, PCB design verification, automotive electronics test, warpage verification, and other services; chemical and material analysis services, includes environmental regulation test, chemical substance management, verification of PCB/ PCBA chemicals, oil/ water/ soil/ gaseous pollutant, and micro pollution test/ analysis; and various consultancy services, includes quality assurance and function safety, ESG, and laboratory accreditation and green mark. The company was founded in 1994 and is based in Hsinchu City, Taiwan.